Kingston Technology KSM32RD4/32SE memory module 32 GB 4 x 72 GB DDR4 3200 MHz ECC

SKU
KSM32RD4/32SE
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In Stock: 43 available
32GB DDR4 3200MT/s ECC Registered DIMM CL22 2Rx4 1.2V 288-pin 8Gbit Samsung E
  • Power Supply: VDD = 1.2V
  • VDDQ = 1.2V
  • VPP = 2.5V
  • VDDSPD = 2.41V to 2.75V
  • Functionality and operations comply with the DDR4 SDRAM datasheet
  • 16 internal banks
  • Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for
  • the banks in the same or different bank group accesses are available
  • Data transfer rates: PC4-3200, PC4-2933, PC4-2666, PC4-2400, PC4-2133, PC4-1866, PC4-1600
  • Bi-Directional Differential Data Strobe
  • 8 bit pre-fetch
  • Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
  • Supports ECC error correction and detection
  • On-Die Termination (ODT)
  • Temperature sensor with integrated SPD
  • This product is in compliance with the RoHS directive
  • Per DRAM Addressability is supported
  • Internal Vref DQ level generation is available
  • Write CRC is supported at all speed grades
  • CA parity (Command/Address Parity) mode is supported
More Information
Internal memory type DDR4
Memory clock speed 3200 MHz
ECC Yes
Memory form factor 288-pin DIMM
SKU KSM32RD4/32SE
EAN 0740617342338
Manufacturer Kingston Technology
Availability In Stock
PDF URLs View PDF
Kingston's KSM32RD4/32SE is a 4G x 72-bit (32GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM) registered w/ parity, 2Rx4, ECC, memory module, based on thirty-six 2G x 4-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. Each 288-pin DIMM uses gold contact fingers.
Power
Memory voltage1.2 V
Design
JEDEC standardYes
Technical details
Supported data transfer ratesPC4-3200, PC4-2933, PC4-2666, PC4-2400, PC4-2133, PC4-1866, PC4-1600
Compliance certificatesRoHS
Memory
Buffered memory typeRegistered (buffered)
Memory layout (modules x size)4 x 72 GB
Internal memory32 GB
Component forServer
Memory form factor288-pin DIMM
CAS latency22
Memory voltage1.2 V
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
SPD profileYes
Memory ranking2
ECCYes
Memory clock speed3200 MHz
Internal memory typeDDR4
Programming power voltage (VPP)2.5 V
Features
On-Die ECCYes
Buffered memory typeRegistered (buffered)
Memory layout (modules x size)4 x 72 GB
Internal memory32 GB
Component forServer
Memory form factor288-pin DIMM
CAS latency22
Memory voltage1.2 V
Row cycle time45.75 ns
Refresh row cycle time350 ns
Row active time32 ns
SPD profileYes
Memory ranking2
ECCYes
Memory clock speed3200 MHz
Internal memory typeDDR4
Programming power voltage (VPP)2.5 V
JEDEC standardYes
Harmonized System (HS) code84733020
Operational conditions
Operating temperature (T-T)0 - 85 °C
Storage temperature (T-T)-55 - 100 °C
Logistics data
Harmonized System (HS) code84733020
Other features
Supported data transfer ratesPC4-3200, PC4-2933, PC4-2666, PC4-2400, PC4-2133, PC4-1866, PC4-1600
Harmonized System (HS) code84733020