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HPE Intel Xeon Gold 6130 processor 2.1 GHz 22 MB L3
SKU
860687-B21
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Out Of Stock - Contact your account manager
Intel Xeon Gold 6130, 22M Cache, 2.1 GHz, 125 W TDP, FCLGA3647
Category: Processors
Processor socket | LGA 3647 (Socket P) |
---|---|
Processor cores | 16 |
Processor family | Intel Xeon Gold |
Processor lithography | 14 nm |
SKU | 860687-B21 |
EAN | 4549821010424 |
Manufacturer | HPE |
Availability | In Stock |
Options, accessories, services and support for all your HP and Compaq products.
Processor | |
---|---|
Processor generation | 1st Generation Intel® Xeon® Scalable |
Processor base frequency | 2.1 GHz |
Cooler included | No |
Processor codename | Skylake |
Thermal Design Power (TDP) | 125 W |
Processor cache | 22 MB |
Processor model | 6130 |
Processor threads | 32 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.7 GHz |
Stepping | H0 |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 16 |
Processor socket | LGA 3647 (Socket P) |
Processor series | Intel Xeon Gold 6000 Series |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 768 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2666 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
On-board graphics card | No |
Power | |
Thermal Design Power (TDP) | 125 W |
Technical details | |
---|---|
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | S4S |
Embedded options available | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 125 W |
Processor series | Intel Xeon Gold 6000 Series |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 125 W |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | S4S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Intel 64 | Yes |
Conflict-Free processor | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Optane™ Memory Ready | No |
Intel TSX-NI | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Operational conditions | |
Tcase | 87 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
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---|---|---|---|---|---|---|
SKU |
860687-B21
|
4XG7A14812
|
P02494-B21
|
P15977-B21
|
P23549-B21
|
4XG7A63350
|
Manufacturer |
HPE
|
Lenovo
|
HPE
|
HPE
|
HPE
|
Lenovo
|
Processor lithography |
up to 22nm
|
up to 22nm
|
up to 22nm
|
up to 22nm
|
up to 22nm
|
up to 22nm
|
Processor family |
Intel Xeon Gold
|
Intel Xeon Silver
|
Intel Xeon Silver
|
Intel Xeon Silver
|
Intel Xeon Silver
|
AMD EPYC
|
Processor socket |
LGA 3647 (Socket P)
|
LGA 3647 (Socket P)
|
LGA 3647 (Socket P)
|
LGA 3647 (Socket P)
|
LGA 3647 (Socket P)
|
Socket SP3
|
Processor cores |
16
|
8
|
8
|
12
|
10
|
8
|
On-board graphics card |
N
|
N
|
N
|
N
|
N
|
N
|
Discrete graphics card |
N/A
|
N
|
N
|
N
|
N
|
N
|
Cooler included |
N
|
N/A
|
N
|
N
|
N
|
N/A
|
Package type |
N/A
|
N/A
|
N/A
|
Tray
|
Tray
|
N/A
|